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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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TS4997 Datasheet(PDF) 30 Page - STMicroelectronics |
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TS4997 Datasheet(HTML) 30 Page - STMicroelectronics |
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30 / 34 page  QFN16 package information TS4997 30/34 5 QFN16 package information In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. Figure 69. QFN16 package Figure 70. Pinout (top view) 56 7 8 16 15 14 13 12 11 10 9 1 2 3 4 LIN- LIN+ RIN+ RIN- LOUT+ LOUT- ROUT+ ROUT- BYP VCC 3D1 3D0 GND GND STBYR STBYL 56 7 8 16 15 14 13 16 15 14 13 12 11 10 9 1 2 3 4 LIN- LIN+ RIN+ RIN- LOUT+ LOUT- ROUT+ ROUT- BYP VCC 3D1 3D0 GND GND STBYR STBYL |
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