MCP3021 datasheet(3/26 Pages) MICROCHIP

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 2003 Microchip Technology Inc.

DS21805A-page 3

MCP3021

TEMPERATURE SPECIFICATIONS

Input leakage current

ILI

-1

—

µA

VIN = VSS to VDD

Output leakage current

ILO

-1

—

µA

VOUT = VSS to VDD

Pin capacitance

(all inputs/outputs)

CIN,

COUT

——

TAMB = 25°C, f = 1 MHz;

(Note 2)

Bus Capacitance

—

400

SDA drive low, 0.4V

Power Requirements

Operating Voltage

VDD

2.7

—

5.5

Conversion Current

IDD

—175

250

µA

Standby Current

IDDS

—

0.005

µA

SDA, SCL = VDD

Active bus current

IDDA

——

120

µA

Note 4

Conversion Rate

Conversion Time

tCONV

—8.96

—

µs

Note 5

Analog Input Acquisition Time

tACQ

—1.12

—

µs

Note 5

Sample Rate

fSAMP

——

22.3

ksps

fSCL = 400 kHz (Note 1)

Electrical Characteristics: All parameters apply across the operating voltage range.

Parameters

Symbol

Min

Typ

Max

Units

Conditions

Temperature Ranges

Extended Temperature Range

-40

—

+125

°C

Operating Temperature Range

-40

—

+125

°C

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 5L-SOT23A

θJA

—

256

—

°C/W

DC ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5.0V, VSS = GND, RPU = 2 kΩ

TA = -40°C to +85°C, I

2C Fast Mode Timing: f

SCL = 400 kHz (Note 3).

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1:

Sample time is the time between conversions after the address byte has been sent to the converter. Refer

to Figure 5-6.

This parameter is periodically sampled and not 100% tested.

RPU = Pull-up resistor on SDA and SCL.

SDA and SCL = VSS to VDD at 400 kHz.

tACQ and tCONV are dependent on internal oscillator timing. See Figure 5-5 and Figure 5-6 for relation to

SCL.

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