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TDA8002CT/A/C1 Datasheet(PDF) 24 Page - NXP Semiconductors |
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TDA8002CT/A/C1 Datasheet(HTML) 24 Page - NXP Semiconductors |
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24 / 28 page ![]() 1999 Oct 12 24 Philips Semiconductors Product specification IC card interface TDA8002C PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT136-1 X 14 28 w M θ A A1 A2 b p D HE L p Q detail X E Z c L v M A e 15 1 (A ) 3 A y 0.25 075E06 MS-013AE pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 95-01-24 97-05-22 |
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