MPC859T datasheet(9/96 Pages) FREESCALE

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MPC866/MPC859 Hardware Specifications, Rev. 2

Freescale Semiconductor

Thermal Characteristics

Table 4 shows the thermal characteristics for the MPC866/859.

Table 4. MPC866/859 Thermal Resistance Data

Rating

Environment

Symbol

Value

Unit

Junction-to-ambient 1

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

Natural Convection

Single-layer board (1s)

RθJA

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

°C/W

Four-layer board (2s2p)

RθJMA

Per JEDEC JESD51-6 with the board horizontal.

Airflow (200 ft/min)

Single-layer board (1s)

RθJMA

Four-layer board (2s2p)

RθJMA

Junction-to-board 4

Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

RθJB

Junction-to-case 5

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate

method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed

pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated

value from the junction to the exposed pad without contact resistance.

RθJC

Junction-to-package top 6

Thermal characterization parameter indicating the temperature difference between package top and junction

temperature per JEDEC JESD51-2.

Natural Convection

ΨJT

Airflow (200 ft/min)

ΨJT

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