13201 datasheet(27/28 Pages) FREESCALE

27 / 28 page

MC13201 Technical Data, Rev. 1.1,

Freescale Semiconductor

Packaging Information

Figure 17. Outline Dimensions for QFN-32, 5x5 mm

(Case 1311-03, Issue E)

EXPOSED DIE

ATTACH PAD

2.95

3.25

32X

0.18

0.30

0.5

0.1

0.05

32X

0.5

0.3

0.1

VIEW M-M

0.25

28X

DETAIL M

PIN 1 INDEX

2.95

3.25

PIN 1

INDEX AREA

0.1

1.0

1.00

0.05

0.1

0.05

SEATING PLANE

DETAIL G

VIEW ROTATED 90° CLOCKWISE

(0.5)

(0.25)

0.8

0.75

0.00

(1.73)

(0.25)

0.065

32X

0.015

(45 )5

PREFERRED CORNER CONFIGURATION

DETAIL N

0.60

0.24

0.60

0.24

DETAIL N

CORNER CONFIGURATION OPTION

DETAIL T

DETAIL M

BACKSIDE PIN 1 INDEX OPTION

DETAIL T

BACKSIDE PIN 1 INDEX OPTION

(90 )

2X 0.39

0.31

0.1

0.0

DETAIL M

BACKSIDE PIN 1 INDEX OPTION

1.6

0.475

0.425

1.5

BACKSIDE

PIN 1 INDEX

0.25

0.15

DETAIL S

DETAIL M

PREFERRED BACKSIDE PIN 1 INDEX

0.217

0.137

(0.25)

0.217

0.137

(0.1)

DETAIL S

PREFERRED BACKSIDE PIN 1 INDEX

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

3. THE COMPLETE JEDEC DESIGNATOR FOR THIS

PACKAGE IS: HF-PQFP-N.

4. CORNER CHAMFER MAY NOT BE PRESENT.

DIMENSIONS OF OPTIONAL FEATURES ARE FOR

REFERENCE ONLY.

5. COPLANARITY APPLIES TO LEADS, CORNER

LEADS, AND DIE ATTACH PAD.

6. FOR ANVIL SINGULATED QFN PACKAGES,

MAXIMUM DRAFT ANGLE IS 12°.

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