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Datasheet, Public

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[v3-00] 2023-Feb-08

TSL2591 − Pack age Drawings & Mark ings

Figure 18:

FN Package – Dual Flat No-Lead Packaging Configuration

Note(s):

1. All linear dimensions are in micrometers.

2. The die is centered within the package within a tolerance of ±75 μm.

3. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

Package Drawings & Markings