1997 Apr 16

10

Philips Semiconductors

Product specification

PCF1172C

PACKAGE OUTLINE

UNIT

Qy

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

inches

0.3

0.1

2.45

2.25

0.25

0.42

0.30

0.22

0.14

15.6

15.2

7.6

7.5

0.762

12.3

11.8

1.15

1.05

0.6

0.3

7

0

o

o

0.1

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

1.7

1.5

SOT158-2

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

y

40

21

20

1

pin 1 index

0.012

0.004

0.096

0.089

0.017

0.012

0.0087

0.0055

0.61

0.60

0.30

0.29

0.03

2.25

0.089

0.48

0.46

0.045

0.041

0.024

0.012

0.004

0.2

0.008

0.004

0.067

0.059

0.010

0

5

10 mm

scale

92-11-17

95-01-24

VSO40: plastic very small outline package; 40 leads; face down

SOT158-2

A

max.

2.70

0.11