HC5523IP datasheet(21/22 Pages) INTERSIL

21 / 22 page

HC5523

Plastic Leaded Chip Carrier Packages (PLCC)

NOTES:

1. Controlling dimension: INCH. Converted millimeter dimensions are

not necessarily exact.

2. Dimensions and tolerancing per ANSI Y14.5M-1982.

3. Dimensions D1 and E1 do not include mold protrusions. Allowable

mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1

and E1 include mold mismatch and are measured at the extreme

material condition at the body parting line.

4. To be measured at seating plane

contact point.

5. Centerline to be determined where center leads exit plastic body.

6. “N” is the number of terminal positions.

-C-

SEATING

PLANE

0.020 (0.51)

MIN

VIEW “A”

D2/E2

0.025 (0.64)

0.045 (1.14)

0.042 (1.07)

0.056 (1.42)

0.050 (1.27) TP

0.042 (1.07)

0.048 (1.22)

PIN (1) IDENTIFIER

0.020 (0.51) MAX

3 PLCS

0.026 (0.66)

0.032 (0.81)

0.045 (1.14)

MIN

0.013 (0.33)

0.021 (0.53)

0.025 (0.64)

MIN

VIEW “A” TYP.

0.004 (0.10)

-C-

D2/E2

N28.45 (JEDEC MS-018AB ISSUE A)

28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

0.165

0.180

4.20

4.57

0.090

0.120

2.29

3.04

0.485

0.495

12.32

12.57

0.450

0.456

11.43

11.58

0.191

0.219

4.86

5.56

4, 5

0.485

0.495

12.32

12.57

0.450

0.456

11.43

11.58

0.191

0.219

4.86

5.56

4, 5

N28

Rev. 2 11/97

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