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LAN91C100FD Datasheet(PDF) 67 Page - SMSC Corporation |
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LAN91C100FD Datasheet(HTML) 67 Page - SMSC Corporation |
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67 / 67 page ![]() SMSC DS – LAN91C100FD REV. B Page 67 Rev. 01-20-06 FIGURE 28 - 208 PIN TQFP PACKAGE OUTLINES 1 2 3 4 5 NOM 30.00 15.00 28.00 30.00 15.00 28.00 0.60 1.00 0.50 BSC DIM A A1 A2 D D/2 D1 E E/2 E1 H L L1 e 0 W R1 R2 ccc ccc REMARK Overall Package Height Standoff Body Thickness X Span 1/2 X Span Measure From Centerline X Body Size Y Span 1/2 Y Span Measure From Centerline Y Body Size Lead Frame Thickness Lead Foot Length From Centerline Lead Length Lead Pitch Lead Foot Angle Lead Width Lead Shoulder Radius Lead Foot Radius Coplanarity (Assemblers) Coplanarity (Test House) MIN 0.05 1.35 29.80 14.90 27.90 29.80 14.90 27.90 0.09 0.45 0 0.17 0.08 0.08 MAX 1.60 0.15 1.45 30.20 15.10 28.10 30.20 15.10 28.10 0.23 0.75 7 0.27 0.20 0.0762 0.08 Notes: Controlling Unit: Millimeter. Tolerance on the position of the leads is 0.04mm maximum. Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25mm. Dimension for foot length L measured at the gauge plane 0.25mm above the seating plane, is 0.78-1.08mm. Details of pin 1 identifier are optional but must be located within the zone indicated. |
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