ES9826 datasheet(87/88 Pages) ESS

No. de pieza	ES9826

Descripción Electrónicos	32-bit High performance 2 Channel ADC w/PGA

PDF	88 Pages

Scroll/Zoom	100%

Fabricante Electrónico	ESS [ESS Technology,Inc]

Página de inicio	http://www.esstech.com

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ES9826 Datasheet

VERSION 0.1.2

ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 • WWW.ESSTECH.COM

RPC-2 Pb-Free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3, <350

Volume mm3, 350 to 2000

Volume mm3, >2000

<1.6 mm

260°C

1.6 mm – 2.5 mm

260°C

250°C

245°C

>2.5 mm

250°C

245°C

Table 27 – RPC-2 Pb free classification temperatures

At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body

temperature (Tp) can exceed the values specified in Table RPC-2. The use of a higher Tp does not change the

classification temperature (Tc).

Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.

The maximum component temperature reached during reflow depends on package thickness and volume. The use of

convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to

differences in thermal mass of SMD packages may still exist.

ES9826 Datasheet(PDF) 87 Page - ESS Technology,Inc