MP6551

– 14V, 5A, H-BRIDGE MOTOR DRIVER

MP6551 Rev. 1.0

MonolithicPower.com

3

7/7/2021

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© 2021 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1, 10

OUT1 (1)

Output terminal 1.

2

VIN (1)

Input supply voltage. Decouple the VIN pin to GND using a

≥100nF ceramic capacitor.

Additional bulk capacitance may be required.

3, 8

OUT2 (1)

Output terminal 2.

4

EN2

OUT2 enable input. Pull the EN2 pin high to enable OUT2; pull EN2 low to force OUT2

into a high-impedance (Hi-Z) state. EN2 is pulled down internally.

5

IN2

OUT2 control input. Pull the IN2 pin high to make OUT2 go high; pull IN2 low to make

OUT2 go low. IN2 is pulled down internally.

6

SR

Slew rate control. Connect a resistor from SR to GND.

7

CM2

OUT2 current measurement output.

9

GND (1)

System ground.

11

CM1

OUT1 current measurement output.

12

nFAULT

Fault indication. The nFAULT pin is an open-drain output. If an over-current (OC) or

over-temperature (OT) fault occurs, nFAULT is pulled low.

13

IN1

OUT1 control input. Pull the IN1 pin high make OUT1 go high; pull IN1 low to make

OUT1 go low. IN1 is pulled down internally.

14

EN1

OUT1 enable input. Pull EN1 high to enable OUT1; pull EN1 low force OUT1 into a

high-impedance (Hi-Z) state. EN1 is pulled down internally.

Note:

1) These pins should have as much PCB copper attached to them as possible. The copper removes the dissipated heat in the device.

ABSOLUTE MAXIMUM RATINGS (2)

Supply voltage (VIN) ..................... -0.3V to +16V

OUTx voltage (VOUTX)................... -0.7V to +16V

All other pins to GND .................. -0.3V to +6.5V

Continuous power dissipation (TA = 25°C) (3)…..

……………………………………………...1.92W

Storage temperature................ -55°C to +150°C

Junction temperature ............................... 150°C

Lead temperature (solder) ....................... 260°C

Recommended Operating Conditions (4)

Supply voltage (VIN) ........................ 2.5V to 14V

Peak output current (IOUT) ............................±5A

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (5)

θJA

θJC

QFN-14 (2.5mmx3mm)...........65......13.....°C/W

Notes:

2) Exceeding these ratings may damage the device.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can cause excessive die temperature, and the

device may go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.