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AS5116 Datasheet(PDF) 32 Page - ams AG |
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AS5116 Datasheet(HTML) 32 Page - ams AG |
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32 / 34 page ![]() Document Feedback AS5116 Mechanical Data Datasheet • PUBLIC DS000686 • v4-00 • 2022-Feb-18 34 │ 32 13 Mechanical Data Figure 42: SOIC8 Die Placement and Hall Array Position (1) All dimensions in micrometers (2) The Hall array center is located in the center of the IC package. Hall array radius is 1.1 mm. (3) Die thickness is 356 µm nominal (4) Adhesive thickness 20 ± 10 µm (5) Leadframe downset 200 ± 25 µm (6) Leadframe thickness 200 ± 8 µm |
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