AD5821 datasheet(5/16 Pages) AD

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AD5821

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 4.

Parameter

Rating

VDD to AGND

–0.3 V to +5.5 V

VDD to DGND

–0.3 V to VDD + 0.3 V

AGND to DGND

–0.3 V to +0.3 V

SCL, SDA to DGND

–0.3 V to VDD + 0.3 V

XSHUTDOWN to DGND

–0.3 V to VDD + 0.3 V

ISINK to AGND

–0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (B Version)

−30°C to +85°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature (TJ MAX)

150°C

WLFCSP Power Dissipation

(TJ MAX − TA)/θJA

θJA Thermal Impedance1

Mounted on 4-Layer Board

95°C/W

Lead Temperature, Soldering

Maximum Peak Reflow Temperature2

260°C (±5°C)

1 To achieve the optimum θJA, it is recommended that the AD5821

be soldered on a 4-layer board.

2 As per JEDEC J-STD-020C.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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