LM1117MPX-ADJ datasheet(7/21 Pages) NSC

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Note 2: The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is

PD =(TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board.

Note 3: For testing purposes, ESD was applied using human body model, 1.5k

Ω in series with 100pF.

Note 4: Typical Values represent the most likely parametric norm.

Note 5: All limits are guaranteed by testing or statistical analysis.

Note 6: Load and line regulation are measured at constant junction room temperature.

Note 7: The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the

output voltage has dropped 100mV from the nominal value obtained at VIN =VOUT +1.5V.

Note 8: The minimum output current required to maintain regulation.

Note 9: Minimum pad size of 0.038in2

Note 10: Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22˚C. For information about improved

thermal performance and power dissipation for the LLP, refer to Application Note AN-1187.

Typical Performance Characteristics

Dropout Voltage (V

IN-V OUT)

Short-Circuit Current

10091922

10091923

Load Regulation

LM1117-ADJ Ripple Rejection

10091943

10091906

LM1117MPX-ADJ Datasheet(PDF) 7 Page - National Semiconductor (TI)

LM1117MPX-ADJ Datasheet(HTML) 7 Page - National Semiconductor (TI)

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