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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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UPD77533 Datasheet(PDF) 85 Page - Renesas Technology Corp |
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UPD77533 Datasheet(HTML) 85 Page - Renesas Technology Corp |
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85 / 104 page  Data Sheet S15671EJ4V0DS 83 µµµµPD77533 22. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact an NEC sales representative. µµµµPD77533S1-YHC: 108-pin plastic BGA (fine pitch) (11 ×××× 11) Soldering Method Soldering Conditions Recommended Condition Symbol Infrared reflow Package peak temperature: 260 °C, Time: 60 seconds max. (at 220 °C or higher), Count: Twice or less, Exposure limit: 3 daysNote (after that, prebake at 125 °C for 10 to 72 hours) IR30-103-2 Note After opening the dry pack, store it at 25 °C or less and 65% RH or less for the allowable storage period. |
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