Nexperia

PESDxUSB3B/C series

ESD protection for differential data lines

8. Package outline

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

PESD1USB3B/C

pesd1usb3b-c_po

Unit

mm

max

nom

min

0.64 0.42

0.82 1.22

A

Dimensions (mm are the original dimensions)

WLCSP5: wafer level chip-size package; 5 bumps (2-1-2)

PESD1USB3B/C

A1

b

0.31

D

E

e

e1

e2

0.80

0.61 0.41

0.77 1.17 0.40 0.40

0.26

0.58 0.40

0.72 1.12

0.21

0

1 mm

scale

detail X

A

A1

X

A

B

C

E

D

2

1

e2

e1

e

b

1/2 e

B1

bump A1

index area

bump A1

index area

18-05-16

Fig. 19. Package outline WLCSP5

PESDXUSB3B_C_SER

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© Nexperia B.V. 2019. All rights reserved

Product data sheet

Rev. 2 — 29 January 2019

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