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DS20002090F-page 29

MCP73871

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

Y2

X2

2.80

2.80

MILLIMETERS

0.50 BSC

MIN

E

MAX

4.00

Contact Pad Length (X20)

Contact Pad Width (X20)

Y1

X1

0.80

0.30

Microchip Technology Drawing C04-2126-ML Rev D

NOM

20-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4 mm Body [QFN]

SILK SCREEN

1

2

20

C1

C2

E

X1

Y1

G1

Y2

X2

C1

Contact Pad Spacing

4.00

Contact Pad to Center Pad (X16)

G1

0.20

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

ØV

EV

EV

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Also called VQFN