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MP4541 Datasheet(PDF) 3 Page - Monolithic Power Systems |
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MP4541 Datasheet(HTML) 3 Page - Monolithic Power Systems |
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3 / 20 page ![]() MP4541 – 80V, 0.8A, SYNCHRONOUS STEP-DOWN CONVERTER MP4541 Rev. 1.0 MonolithicPower.com 3 5/28/2021 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2021 MPS. All Rights Reserved. PIN FUNCTIONS Pin # Name Description 1 EN Power enable. Pull the EN pin high to turn on the MP4541. Pull EN low to turn off the MP4541. Do not float the EN pin. 2 VCC Internal LDO output. VCC supplies power to the internal control circuit. Decouple VCC with a ≥1μF ceramic capacitor. 3 FREQ Switching frequency (fSW) setting. Connect an external resistor from the FREQ pin to the GND pin to set the buck fSW. 4 FB Output voltage (VOUT) feedback. Connect a resistor divider from the output to the FB pin. 5 BST Bootstrap power for the high-side MOSFET (HS-FET) gate driver. Connect a 0.1 μF capacitor between the BST and SW pins. 6 SW Switch node of the converter. Connect the SW pin to the source of the HS-FET and the drain of the low-side MOSFET (LS-FET). 7 GND Power ground. 8 VIN Power supply input. ABSOLUTE MAXIMUM RATINGS (1) VIN, EN ....................................... -0.3V to +85V SW .............................................. -0.5V to +85V SW (<20ns) .................................... -5V to +88V BST to SW ..................................... -0.3V to +6V All other pins ……………………….. -0.3V to +6V Continuous power dissipation (TA = 25°C) ............................................................. 3.2W (2) (4) Junction temperature .. …………………… 150°C Lead temperature ………………………… 260°C Storage temperature ………….. -65°C to +150°C Recommended Operating Conditions (3) Supply voltage (VIN) .…………………. 8V to 80V Output voltage (VOUT)…………………. 1V to 30V Operating junction temp (TJ)… -40°C to +125°C Thermal Resistance θJA θJC SOIC-8EP EV4541-N-00A (4) ………. 38……... 7.5…..°C/W JESD51-7 (5) …………….. 48……... 10…...°C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum allowable power dissipation can cause excessive die temperature, and the converter may go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on the EV4541-N-00A, a 63.5mmx63.5mm, 1oz, 2- layer PCB. 5) The value of θ JA given in this table is only valid for comparison with other packages, and cannot be used for design purposes. These values were calculated in accordance with JESD51-7, and simulated on a specified JEDEC board. They do not represent the performance obtained in an actual application. |
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