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SOLDER ABILITY

Item

Requirement

Test Condition

Solderability

Wet Solder Coverage:

90 % Min.

Solder Temperature: 245±3°C Immersion

Duration: 3±0.5 sec.

Solder: Sn-3Ag-0.5Cu

Flux: RMA 25%

Solder-Heat Resistance

△R=40mΩMax.

No evidence of deformation

or fusion of housing and no

physical damage after test.

Test connector on PC Board.

Pre-heat: 150 to 180°C for 90 sec.

Heat 230°C for 30 sec.

Peak Temp.: 255 °C

Reflow Profile

Preheating temperature: 150 ~ 200°C, 60~120 seconds

Liquidus temperature (TL): 217°C, 60~150 seconds

Peak temperature: 260°C

Time within 5 °C of peak temperature (Tc): 255°C, 30seconds