LXT971ABC datasheet(88/90 Pages) INTEL

No. de pieza	LXT971ABC

Descripción Electrónicos	3.3V Dual-Speed Fast Ethernet PHY Transceiver

PDF	90 Pages

Scroll/Zoom	100%

Fabricante Electrónico	INTEL [Intel Corporation]

Página de inicio	http://www.intel.com

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88 / 90 page

LXT971A 3.3V Dual-Speed Fast Ethernet Transceiver

Datasheet

Document #: 249414

Revision #: 002

Rev. Date: August 7, 2002

7.0

Package Specifications

Figure 43. PBGA Package Specification

1.26 ± 0.10

0.70 ± 0.025

0.26 ± 0.04

0.28 ± 0.10

SEATING PLANE

SIDE VIEW

TOP VIEW

BOTTOM VIEW

OPTION:

PIN A1 IDENTIFIER

1.00 ± 0.10

INK OR LASER MARKING

7.00 ± 0.20

2.00 REF.

0.20 (4X)

NOTES:

1. All dimensions and tolerances conform to ASME Y 14.5 M - 1994.

2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.

3. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

4. Maximum mold to substrate offset shall be 0.127.

5. The surface finish of the package shall be EDM Charmille #18 - #21.

6. Unless otherwise specified tolerance: Decimal ± 0.05 Angular ±2°.

0.70 REF.

6.30

0.80

0.40 ± 0.15

0.30

0.15

64-Ball Plastic Ball Grid Array Package

• Part Number - LXT971ABC Commercial Temperature Range (0ºC to +70ºC)

• Part Number - LXT971ABE Extended Temperature Range (-40ºC to +85ºC)

LXT971ABC Datasheet(PDF) 88 Page - Intel Corporation