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RT9703CS Datasheet(PDF) 12 Page - Richtek Technology Corporation |
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RT9703CS Datasheet(HTML) 12 Page - Richtek Technology Corporation |
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12 / 14 page ![]() 12 RT9703 Preliminary The normal current limit value, ILIMIT, is set with an external resistor between IP (pin 8) and GND (pin 4). When a heavy load or short circuit is applied to an enabled switch, a large transient current may flow until the current limit circuitry responds. Once this current limit threshold is exceeded, the device enters constant current mode until the thermal shutdown occurred or the fault is removed. It is important to note that the maximum current limit value shall be set properly in accordance with its supply voltage otherwise it may result in the failure occurrence. The graph below shows the maximum current limit and supply voltage on the safe operation area. Thermal Shutdown Thermal shutdown is employed to protect the device from damage if the die temperature exceeds approxi- mately 130 °C. If enabled, the switch automatically restarts when the die temperature falls 10 °C. The output and FLG signal will continue to cycle on and off until the device is disabled or the fault is removed. Power Dissipation The device's junction temperature depends on several factors such as the load, PCB layout, ambient temperature and package type. The output pin of RT9703 can deliver a current of up to 3A over the full operating junction temperature range. However, the maximum output current must be derated at higher ambient temperature to ensure the junction temperature does not exceed 100°C. With all possible conditions, the junction temperature must be within the range specified under operating conditions. Power dissipation can be calculated based on the output current and the RDS(ON) of switch as below. PD = RDS(ON) x IOUT2 Although the devices are rated for 3A of output current, but the application may limit the amount of output current based on the total power dissipation and the ambient temperature. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: PD (MAX) = ( TJ (MAX) - TA ) / θθθθθJA Where TJ (MAX) is the maximum junction temperature of the die (100° C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance ( θJA) for SOP-8 package at recommended minimum footprint is 104°C/W ( θJA is layout dependent). Supply Filter/Bypass Capacitor A 10 µF low-ESR ceramic capacitor from VIN to GND (the amount of the capacitance may be increased without limit), located at the device is strongly recommended to prevent the input voltage drooping during hot-plug events. However, higher capacitor values will further reduce the voltage droop on the input. Furthermore, without the bypass capacitor, an output short may cause sufficient ringing on the input (from source lead inductance) to destroy the internal control circuitry. An important note to be award of is the parasitic inductance of PCB traces can cause over-voltage transients if the PCB trace has even a few tens of nH of inductance. It is recommended to use aluminum electrolytic acted the supply capacitor to prevent the device from being damaged. The input transient must not exceed 6.5V of the absolute maximum supply voltage even for a short duration. Maximun Current Limit vs. Supply Voltage 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 2 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) TA = 25 °C |
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