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TDLNA2626SEP Datasheet(PDF) 9 Page - Teledyne Technologies Incorporated |
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TDLNA2626SEP Datasheet(HTML) 9 Page - Teledyne Technologies Incorporated |
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9 / 10 page ![]() www.tdehirel.com TDLNA2626SEP Evaluation Board and Mounting Detail Preliminary Specification RF Layer is 0.008” thick Rogers Corp. RO4003C (εr = 3.35). Metal layers are 0.5 oz. copper. The microstrip line at the connector interface is optimized for the Southwest Microwave end launch connector 1492-04A-5. All data de-embedded to the device reference plane (shown). Ref. Des. Component Value Manuf. Part Number C3, C12 Surface Mount Cap. CAP 0.01 µF +/-10% 50V 0402 X7R ROHS Various C6, C15 Surface Mount Cap. CAP 1.0 µF +/-10% 16V 0603 X7R ROHS Various C9, C18 Surface Mount Cap. CAP CER 10 µF 10V X7R 10% 0805 TDK ROHS Various Document #: TDLNA2626SEP-06-2023 Rev 0.7a Page 9 of 10 |
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