MCP6241-ESLASHMS datasheet(3/20 Pages) MICROCHIP

3 / 20 page

 2004 Microchip Technology Inc.

DS21882B-page 3

MCP6241/2

AC ELECTRICAL SPECIFICATIONS

TEMPERATURE SPECIFICATIONS

Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8 to 5.5V, VSS = GND, VCM = VDD/2,

VOUT ≈ VDD/2, RL = 10 kΩ to VDD/2 and CL = 60 pF.

Parameters

Sym

Min

Typ

Max

Units

Conditions

AC Response

Gain Bandwidth Product

GBWP

—

650

—

kHz

Phase Margin

—

G = +1

Slew Rate

—

0.30

—

V/µs

Noise

Input Noise Voltage

Eni

—

µVp-p

f = 0.1 Hz to 10 Hz

Input Noise Voltage Density

eni

—45

—

nV/

√Hz f = 1 kHz

Input Noise Current Density

ini

—0.6

—

fA/

√Hz f = 1 kHz

Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V and VSS = GND.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Extended Temperature Range

-40

—

+125

°C

Operating Temperature Range

-40

—

+125

°C

(Note)

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 5L-SC70

—

331

—

°C/W

Thermal Resistance, 5L-SOT-23

—

256

—

°C/W

Thermal Resistance, 8L-PDIP

—85

—

°C/W

Thermal Resistance, 8L-SOIC

—163

—

°C/W

Thermal Resistance, 8L-MSOP

—206

—

°C/W

Note:

The internal Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.

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