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BSP255 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BSP255 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 10 page ![]() 1996 Aug 05 3 Philips Semiconductors Product specification P-channel enhancement mode vertical D-MOS transistor BSP255 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Notes 1. Ts is the temperature at the soldering point of the drain lead. 2. Pulse width and duty cycle limited by maximum junction temperature. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage (DC) −−300 V VGS gate-source voltage (DC) −±20 V ID drain current (DC) Ts = 100 °C; note 1 −−325 mA IDM peak drain current note 2 −−1.3 A Ptot total power dissipation Ts = 100 °C − 4W Tstg storage temperature −65 +150 °C Tj operating junction temperature −65 +150 °C Source-drain diode IS source current (DC) Ts = 100 °C −−0.5 A ISM peak pulsed source current note 2 −−2A Fig.2 Power derating curve. handbook, halfpage 0 200 10 0 2 4 6 8 MBH446 50 100 150 Ptot (W) Ts ( oC) δ = 0.01; TS = 100 °C. (1) RDSon limitation. Fig.3 DC SOAR. handbook, halfpage MBH445 −1 −10 −1 −10−1 −10−2 −10−3 −102 −103 −10 VDS (V) t p T P t t p T δ = 1 ms 100 µs 10 ms DC (1) tp = 10 µs ID (A) |
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