OUTLINE DIMENSIONS

UPC1676P (CHIP)

(Units in

µm)

• Die Size: 0.60 mm x 0.65 mm

• Thickness: 170

± 30 µm

• Pad Size: 100

µm x 100 µm

• Ti/Pt/Au Metallization

BONDING PAD (mm)

BONDING

PAD

PAD NO.

X AXIS

Y AXIS

CONNECTION

1

-185

210

INPUT

2

-5

-210

GND

3

+185

-210

GND

4

+185

-210

OUTPUT

5

-175

+210

UPC1676B

PACKAGE OUTLINE B08

(Units in mm)

CHIP FEATURES

BONDING INFORMATION

5. Output

6. GND

8. GND

LEAD

CONNECTIONS

1. Input

2. GND

3. GND

4. GND

5

4

1

2

3

PIN

CONNECTIONS

1. GND

2. Output

4. Input

UPC1676G

PACKAGE OUTLINE 39

(Units in mm)

2.8

+0.2

-0.3

+0.10

-0.05

(LEADS 2, 3, 4)

0.6

+0.10

-0.05

0.16

+0.10

-0.06

5˚

5˚

0.8

1.1

+0.2

-0.1

1

2

3

0 to 0.1

4

0.4

2.9

± 0.2 0.95

0.85

1.9

1.5

+0.2

-0.1

(LEADS 2, 4, 6, 8) 0.6

1.27±0.1 1.27±0.1

10.6 MAX

3.8±0.2

5

4

3

2

6

7

8

3.8±0.2

10.6 MAX

1

1.7 MAX

0.2

+0.05

-0.02

0.4 (LEADS 1, 3, 5, 7)

UPC1676B, UPC1676G, UPC1676P

Note:

All dimensions are typical unless otherwise specified.

PART NUMBER

QTY

UPC1676G-T1

3000 / Reel

ORDERING INFORMATION

EXCLUSIVE NORTH AMERICAN AGENT FOR

RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279

24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM

PRINTED IN USA ON RECYCLED PAPER -3/97

DATA SUBJECT TO CHANGE WITHOUT NOTICE