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STLM20W89F Datasheet(PDF) 9 Page - STMicroelectronics |
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STLM20W89F Datasheet(HTML) 9 Page - STMicroelectronics |
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9 / 17 page ![]() STLM20 Maximum rating 9/17 3 Maximum rating Stressing the device above the rating listed in the Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 5. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature –65 to +150 °C TSLD (1) 1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C for between 90 to 150 seconds). Lead solder temperature for 10 seconds 260 °C VO Output voltage –0.6 to VCC + 0.6 V VCC Supply voltage –0.2 to 6.5 V IO Output current 10 mA TJ(max) Maximum junction temperature 150 °C PD Power dissipation 377 mW TA (2) 2. Grade 7: STLM20DD7F and STLM20W87F Grade 9: STLM20DD9F and STLM20W89F. Ambient operating temperature Grade 7 –55 to 130 °C Grade 9 –40 to 85 °C |
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