MPC821 datasheet(7/242 Pages) NXP

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Hardware Preparation and Installation

MPC8XXFADS Design Specification—Rev 0.1

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

2 - Hardware Preparation and Installation

2•1

INTRODUCTION

This chapter provides unpacking instructions, hardware preparation, and installation instructions for

the MPC8XXFADS.

2•2

UNPACKING INSTRUCTIONS

NOTE

If the shipping carton is damaged upon

receipt, request carrier’s agent to be present

during

unpacking

and

inspection

equipment.

Unpack equipment from shipping carton. Refer to packing list and verify that all items are present.

Save packing material for storing and reshipping of equipment.

CAUTION

AVOID

TOUCHING

AREAS

INTEGRATED

CIRCUITRY;

STATIC

DISCHARGE CAN DAMAGE CIRCUITS.

2•3

HARDWARE PREPARATION

To select the desired configuration and ensure proper operation of the MPC8XXFADS board,

changes of the Dip-Switch settings may be required before installation. The location of the switches,

LEDs, Dip-Switches, and connectors is illustrated in FIGURE 2-1. The board has been factory tested

and is shipped with Dip-Switch settings as described in the following paragraphs. Parameters can be

changed for the following conditions:

•

ADI port address

•

MPC Clock Source

•

Power-On Reset Source.

•

MPC Keep Alive Power Source

•

MPC Internal Logic Supply Source

•

Debug Mode Indication Source

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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