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105 Hardware Specifications

Preliminary/Subject to Change without Notice

1.5 MPC105 Package Description

The following sections provide the package parameters and the mechanical dimensions for the MPC105.

1.5.1 Package Parameters

The package parameters are as provided in the following list. The package type is a 21 mm x 25 mm, 304-

pin C4 ceramic ball grid array (CBGA).

Package outline

21 mm x 25 mm

Interconnects

303

Pitch

1.27 mm

Solder attach

63/37 Sn/Pb

Solder balls

10/90 Sn/Pb

Maximum module height

3.16 mm

Co-planarity specification

0.20 mm

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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