ADF4002BCPZ datasheet(19/24 Pages) AD

No. de pieza	ADF4002BCPZ

Descripción Electrónicos	Phase Detector/Frequency Synthesizer

PDF	24 Pages

Scroll/Zoom	100%

Fabricante Electrónico	AD [Analog Devices]

Página de inicio	http://www.analog.com

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19 / 24 page

ADF4002

Rev. 0 | Page 19 of 24

The bottom of the lead frame chip scale package has a central

thermal pad.

The thermal pad on the printed circuit board should be at least

as large as this exposed pad. On the printed circuit board, there

should be a clearance of at least 0.25 mm between the thermal

pad and the inner edges of the pad pattern. This ensures that

shorting is avoided.

Thermal vias can be used on the printed circuit board thermal

pad to improve thermal performance of the package. If vias are

used, they should be incorporated in the thermal pad at a 1.2 mm

pitch grid. The via diameter should be between 0.3 mm and

0.33 mm and the via barrel should be plated with 1 oz. copper

to plug the via.

The user should connect the printed circuit board thermal pad

to AGND.

ADF4002BCPZ Datasheet(PDF) 19 Page - Analog Devices