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HCTS86DMSR Datasheet(PDF) 8 Page - Renesas Technology Corp |
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HCTS86DMSR Datasheet(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page ![]() HCTS86MS FN2249 Rev 2.00 Page 8 of 8 October 1995 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20 x 2.24 (mm) METALLIZATION: Type: SiAl Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCTS86MS A1 VCC B4 B1 (2) Y1 (3) A2 (4) B2 (5) (6) (7) (8) (9) A3 (10) B3 (11) Y4 (12) A4 (1) (14) (13) Y2 GND Y3 |
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