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HCS11MS Datasheet(PDF) 6 Page - Renesas Technology Corp |
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HCS11MS Datasheet(HTML) 6 Page - Renesas Technology Corp |
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6 / 7 page ![]() HCS11MS FN3048 Rev 0.00 Page 6 of 7 November 1994 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20 x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ DIE ATTACH: Material: Silver Epoxy WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 x 4 mils Metallization Mask Layout HCS11MS A1 VCC C1 B1 (2) A2 (3) B2 (4) C2 (5) (6) (7) (8) (9) A3 (10) B3 (11) C3 (12) Y1 (1) (14) (13) Y2 GND Y3 |
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