3

Recommendation on PCB assembly

3.1

Land pattern

Figure 13. PCB land pattern recommendations

IN

OUT

GND3

GND2

GND1

GND4

300 µm

150 µm

150 µm

150 µm

150 µm

200 µm

500 µm

587 µm

587 µm

45 µm

106.4 µm

106.4 µm

200 µm

104 µm 104 µm

1500 µm

Top_layer

Top_solder_mask

Transmission line between MLPF and antenna is dimensioned to 50 ohms characteristic impedance.

Transmission line between STM32 and MLPF is dimensioned to 62 ohms characteristic impedance.

Theses transmission line characteristics impedances have to be followed as close as possible.

Moreover, lines physical dimensions will have to be tuned according to specific PCB stack up if different from the

one presented in datasheet to keep expected characteristic impedance values.

Figure 14. PCB stack-up recommendations

Copper

48µm

Solder resist

Core, FR4

1507µm

Copper

48µm

MLPF-WB55-01E3

Recommendation on PCB assembly

DS12804 - Rev 3

page 8/13