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CD4070BMS Datasheet(PDF) 8 Page - Renesas Technology Corp |
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CD4070BMS Datasheet(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page ![]() CD4070BMS, CD4077BMS FN3322 Rev 0.00 Page 8 of 8 December 1992 FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A FUNCTION OF SUPPLY VOLTAGE FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF INPUT FREQUENCY Chip Dimensions and Pad Layout CD4077BMSH Dimensions and pad layout for CD4070BMSH are identical Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11k Å 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches Typical Performance Characteristics (Continued) AMBIENT TEMPERATURE (TA) = +25oC LOAD CAPACITANCE (CL) = 50pF 200 100 300 0 5 10 15 20 SUPPLY VOLTAGE (VDD) (V) 10V 5V 10V AMBIENT TEMPERATURE (TA) = +25oC CL = 15pF CL = 50pF SUPPLY VOLTAGE (VDD) = 15V 8 6 4 28 6 4 22 INPUT FREQUENCY (fI) (kHz) 10-1 110 102 103 8 6 4 28 6 42 8 6 4 104 6 4 2 102 10 1 10-1 6 4 2 6 4 2 103 6 4 2 104 6 4 2 105 6 4 2 LOAD CAPACITANCE |
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