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X0402MB Datasheet(PDF) 6 Page - STMicroelectronics |
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X0402MB Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 11 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DPAK package information • Molding compouned resin is halogen free and meets UL94 flammability standard, level V0 • Lead-free package leads plating Figure 13. DPAK package outline X0402MB Package information DS14030 - Rev 1 page 6/11 |
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