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DFE252012P-2R2M Datasheet(PDF) 38 Page - Microchip Technology

No. de pieza DFE252012P-2R2M
Descripción Electrónicos  Cost and Size Optimized PMIC for SAMA5DX/SAM9X6/SAMA7G Series MPUs
PDF  44 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DFE252012P-2R2M Datasheet(HTML) 38 Page - Microchip Technology

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MCP16501
DS20006388A-page 38
 2020 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.80
2.80
MILLIMETERS
0.50 BSC
MIN
E
MAX
4.00
Contact Pad Length (X24)
Contact Pad Width (X24)
Y1
X1
0.80
0.30
NOM
C1
Contact Pad Spacing
4.00
Contact Pad to Contact Pad (X20)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Contact Pad to Center Pad (X24)
G1
0.20
C1
C2
EV
EV
E
X1
G2
Y1
G1
ØV
SILK SCREEN
X2
Y2
Microchip Technology Drawing C04-23387 Rev A
24-Lead Very Thin Plastic Quad Flat, No Lead Package (RMB) - 4x4 mm Body [VQFN]
Atmel Legacy Global Package Code ZZP



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