EXAMPLE BOARD LAYOUT

4226290/A 09/2020

www.ti.com

B3QFN - 4.05 mm max height

RDF0022A

PLASTIC QUAD FLAT PACK- NO LEAD

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 12X

SOLDER MASK DETAILS

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

METAL

SOLDER MASK

OPENING

EXPOSED METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

EXPOSED METAL

NON- SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

(R 0.05) TYP

(0.05) MIN

ALL AROUND

TYP

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

.

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

2X (2.25)

2X (0.75)

2X (6.5)

0.000 PKG ℄

4X (3.3)

(5.7)

4X (1)

20X (0.65)

4X (1.4)

14X (1.2)

4X (0.9)

(Ø0.2) TYP

1

9

10

18

19

4X (1.075)

14X (0.25)

20

21

22