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ATMEGA6450/V Datasheet(PDF) 3 Page - ATMEL Corporation |
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ATMEGA6450/V Datasheet(HTML) 3 Page - ATMEL Corporation |
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3 / 347 page ![]() 3 ATmega325/3250/645/6450 2570A–AVR–09/04 Figure 2. Pinout ATmega325/645 Note: The large center pad underneath the MLF packages is made of metal and internally con- nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. Disclaimer Typical values contained in this datasheet are based on simulations and characteriza- tion of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. PC0 (RXD/PCINT0) PE0 (TXD/PCINT1) PE1 (XCK/AIN0/PCINT2) PE2 (AIN1/PCINT3) PE3 (USCK/SCL/PCINT4) PE4 (DI/SDA/PCINT5) PE5 (DO/PCINT6) PE6 (CLKO/PCINT7) PE7 (SCK/PCINT9) PB1 (MOSI/PCINT10) PB2 (MISO/PCINT11) PB3 (OC0A/PCINT12) PB4 (OC1B/PCINT14) PB6 (OC1A/PCINT13) PB5 PC1 PG0 PC2 PC3 PC4 PC5 PC6 PC7 PA7 PG2 PA6 PA5 PA4 PA3 PG1 INDEX CORNER (SS/PCINT8) PB0 2 3 1 4 5 6 7 8 9 10 11 12 13 14 16 15 47 46 48 45 44 43 42 41 40 39 38 37 36 35 33 34 ATmega325/645 DNC |
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