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2SC1926 Datasheet(PDF) 3 Page - Renesas Technology Corp |
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2SC1926 Datasheet(HTML) 3 Page - Renesas Technology Corp |
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3 / 6 page ![]() © 1996 DATA SHEET SILICON TRANSISTOR 2SC1926 DESCRIPTION The 2SC1926 is an NPN silicon epitaxial dual transistor that consists of two chips equivalent to the 2SC1275, and is designed for differential amplifier and ultra-high-speed switching applications. ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C) PARAMETER SYMBOL RATINGS UNIT Collector to Base Voltage VCBO 30 V Collector to Emitter Voltage VCEO 14 V Emitter to Base Voltage VEBO 3.0 V Collector Current IC 50 mA Collector Dissipation PC 200 mW/unit Total Power Dissipation PT 300 mW Junction Temperature Tj 200 ˚C Storage Temperature Tstg –65 to +200 ˚C ELECTRICAL CHARACTERISTICS (TA = 25 ˚C) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Collector Cut-off Current ICES VCE = 15 V, RBE = 0 50 nA Emitter Cut-off Current IEBO VEB = 2.0 V, IC = 0 50 nA DC Current Gain hFE VCE = 10 V, IC = 10 mA 25 80 200 hFE Ratio hFE1/hFE2 VCE = 10 V, IC = 10 mA *1 0.8 1.0 Difference of Base to Emitter Voltage ∆VBE VCE = 10 V, IC = 10 mA 30 mV Gain Bandwidth Product fT VCE = 10 V, IC = 10 mA *2 1.5 2.0 GHz Output Capacitance Cob VCB = 10 V, IE = 0, f = 1.0 MHz *3 1.1 1.5 pF *1. hFE1 is the smaller hFE value of the 2 transistors. 2. Sampling check shall be done on a production lot base using a TO-18 packaged device (equivalent to the 2SC1275). 3. Measured with a 3-terminal bridge, terminals other than the collector and base of the device under test should be connected to the guard terminal of the bridge. Document No. P11670EJ1V0DS00 (1st edition) Date Published July 1996 P Printed in Japan NPN SILICON EPITAXIAL DUAL TRANSISTOR FOR DIFFERENTIAL AMPLIFIER AND ULTRA HIGH SPEED SWITCHING INDUSTRIAL USE PACKAGE DIMENSIONS (in millimeters) 5.0 MIN. 3.5 +0.3 –0.2 5.0 MIN. 3 2 1 4 5 6 3 2C 4 1C 6 1B 1 2B 5 E 2 PIN CONNECTIONS |
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