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STM32H757AI Datasheet(PDF) 234 Page - STMicroelectronics |
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STM32H757AI Datasheet(HTML) 234 Page - STMicroelectronics |
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234 / 251 page ![]() Package information STM32H757xI 234/251 DS12931 Rev 1 7.2 UFBGA169 package information UFBGA169 is a 169-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package. Figure 75. UFBGA169 package outline 1. Drawing is not in scale. Table 134. UFBGA169 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 - 0.130 - - 0.0051 - A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.230 0.280 0.330 0.0091 0.0110 0.0130 D 6.950 7.000 7.050 0.2736 0.2756 0.2776 D1 5.950 6.000 6.050 0.2343 0.2362 0.2382 E 6.950 7.000 7.050 0.2736 0.2756 0.2776 E1 5.950 6.000 6.050 0.2343 0.2362 0.2382 e - 0.500 - - 0.0197 - F 0.450 0.500 0.550 0.0177 0.0197 0.0217 A0YV_ME_V2 Seating plane A2 A1 A e F F e N A BOTTOM VIEW E D TOP VIEW Øb (169 balls) Y X Y eee Ø M fff Ø M Z Z X A1 ball identifier A1 ball index area b D1 E1 A4 A3 13 1 Z Z ddd SIDE VIEW |
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