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STM32H757AI Datasheet(PDF) 233 Page - STMicroelectronics

No. de pieza STM32H757AI
Descripción Electrónicos  Dual 32-bit Arm® Cortex®-M7 up to 480MHz and -M4 MCUs, 2MB Flash, 1MB RAM, 46 com. and analog interfaces, SMPS, DSI, crypto
PDF  251 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H757AI Datasheet(HTML) 233 Page - STMicroelectronics

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DS12931 Rev 1
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STM32H757xI
Package information
249
Device marking for WLSCP156
The following figure gives an example of topside marking versus pin 1 position identifier
location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which depend on supply chain operations, are
not indicated below.
Figure 74. WLCSP156 marking example (package top view)
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
Table 133. WLCSP156 bump recommended PCB design rules
Dimension
Recommended values
Pitch
0.35 mm
Dpad
0.210 mm
Dsm
0.275 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.235 mm
Stencil thickness
0.100 mm
MSv61386V1
Revision code
Ball A1
identifier
Product
identification(1)
Date code
32H757ZIY6
WW
Y
R



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