3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®

packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions

and product status are available at: www.st.com. ECOPACK® is an ST trademark.

3.1

D²PAK package information

•

ECOPACK2® compliant

•

Lead-free package leads finishing

•

Molding compound resin is halogen-free and meets UL standard level V0

Figure 14. D²PAK package outline

e

G

E1

E2

c2

A

b

b2

E

V2

c

A1

A2

A3

R

Gauge Plane

1

2

3

Max resin gate protrusion: 0.5 mm (1)

(1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.

T835T-8G

Package information

DS12531 - Rev 3

page 7/11