Rev Date: 11/18/2020

3

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Please confirm technical specifications before you order and/or use.

HVC Series

High Voltage Thick Film Chip Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

Recommended Solder Profile

This information is intended as a reference for solder profiles for Stackpole resistive components. These profiles should

be compatible with most soldering processes. These are only recommendations. Actual numbers will depend on board

density, geometry, packages used, etc., especially those cells labeled with “*”.

100% Matte Tin / RoHS Compliant Terminations

Soldering iron recommended temperatures: 330°C to 350°C with minimum duration.

Maximum number of reflow cycles: 3.

Wave Soldering

Description

Maximum

Recommended

Minimum

Preheat Time

80 seconds

70 seconds

60 seconds

Temperature Diff.

140°C

120°C

100°C

Solder Temp.

260°C

250°C

240°C

Dwell Time at Max.

10 seconds

5 seconds

*

Ramp DN (°C/sec)

N/A

N/A

N/A

Temperature Diff. = Defference between final preheat stage and soldering stage.

Convection IR Reflow

Description

Maximum

Recommended

Minimum

Ramp Up (°C/sec)

3°C/sec

2°C/sec

*

Dwell Time > 217°C

150 seconds

90 seconds

60 seconds

Solder Temp.

260°C

245°C

*

Dwell Time at Max.

30 seconds

15 seconds

10 seconds

Ramp DN (°C/sec)

6°C/sec

3°C/sec

*

Recommended Pad Layouts (cont.)

Type / Code

A

B

C

Unit

0.087

0.165

0.063

inches

2.20

4.20

1.60

mm

0.138

0.240

0.110

inches

3.50

6.10

2.80

mm

0.150

0.315

0.138

inches

3.80

8.00

3.50

mm

HVC2010

HVC2512

HVC1206