ACS108-6S

4 Package information

9/11

4.2

SOT-223 Mechanical data

Figure 18. SOT-223 Footprint

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in compliance

with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are

available at: www.st.com.

REF.

DIMENSIONS

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.80

0.071

A1

0.02

0.001

B

0.60

0.70

0.80

0.024

0.027

0.031

B1

2.90

3.00

3.10

0.114

0.118

0.122

c

0.24

0.26

0.32

0.009

0.010

0.013

D

6.30

6.50

6.70

0.248

0.256

0.264

e

2.3

0.090

e1

4.6

0.181

E

3.30

3.50

3.70

0.130

0.138

0.146

H

6.70

7.00

7.30

0.264

0.276

0.287

V

10° max

A

A1

e1

D

B1

H

E

e

12

4

3

B

V

c

3.25

1.32

7.80

5.16

1.32

2.30

0.95