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HT48C10 Datasheet(PDF) 5 Page - Holtek Semiconductor Inc |
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HT48C10 Datasheet(HTML) 5 Page - Holtek Semiconductor Inc |
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5 / 59 page ![]() Note: For the dice form, the TMR0 and TMR1 pads have to be bonded to VDD or VSS if the TMR0 and/or TMR1 pad are not used. The (TMR0) INT indicates that the TMR0 pad should be bonded to the INT pin. The PC5 (TMR1) indicates that the TMR1 pad should be bonded to the PC5 pin. HT48CXX/HT48RXX 5 25th May ’99 |
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