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STM32F103XC Datasheet(PDF) 122 Page - STMicroelectronics |
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STM32F103XC Datasheet(HTML) 122 Page - STMicroelectronics |
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122 / 143 page ![]() Package information STM32F103xC, STM32F103xD, STM32F103xE 122/143 DS5792 Rev 13 6.4 LQFP144 package information Figure 70. LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package outline 1. Drawing is not to scale. Stencil Thickness Between 100 µm to 125 µm Pad trace width 100 µm Ball Diameter 320 µm Table 70. WLCSP64 recommended PCB design rules (0.5 mm pitch) (continued) Dimension Recommended values |
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