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STM32F103XC Datasheet(PDF) 121 Page - STMicroelectronics

No. de pieza STM32F103XC
Descripción Electrónicos  High-density performance line Arm®-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  143 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103XC Datasheet(HTML) 121 Page - STMicroelectronics

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DS5792 Rev 13
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STM32F103xC, STM32F103xD, STM32F103xE
Package information
135
Figure 69. WLCSP64 - 64-ball, 4.4757 x 4.4049 mm, 0.5 mm pitch wafer level chip scale
package recommended footprint
b(2)
0.290
0.320
0.350
0.0114
0.0126
0.0138
e
-
0.500
-
-
0.0197
-
e1
-
3.500
-
-
0.1378
-
F
-
0.447
-
-
0.0176
-
G
-
0.483
-
-
0.0190
-
D
4.446
4.466
4.486
0.1750
0.1758
0.1766
E
4.375
4.395
4.415
0.1722
0.1730
0.1738
H
-
0.250
-
-
0.0098
-
L
-
0.200
-
-
0.0079
-
eee
-
0.05
-
-
0.0020
-
aaa
-
0.10
-
-
0.0039
-
Number of balls
64
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum ball diameter parallel to primary datum Z.
Table 70. WLCSP64 recommended PCB design rules (0.5 mm pitch)
Dimension
Recommended values
Pitch
0.5
Dpad
250 µm
Dsm
300 µm
Stencil Opening
320 µm
Table 69. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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