IWC0805DR10R-3G datasheet(7/7 Pages) LSTD

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6.RELIABILITY

Inspect device construction, marking and workmanship.

Electrical Test not required.

MIL-STD-883 Method

2009

Parametrically test per lot and sample size requirements,

summary to show Min, Max, Mean and Standard deviation

at room as well as Min and Max Operating temperatures.

User Spec.

Electrical

Characterization

Vibration

245±5℃, 5±1sec, Solder: Sn/3.0Ag/0.5Cu

Resistance to

Soldering Heat

Verify physical dimensions to the applicable device detail

specification. Note: User(s) and Suppliers spec. Electrical

Test not required.

JESD22 Method JB-100

Physical Dimension

Terminal Strength

AEC-Q200-006

Force:10N, Dwell:5+1 sec, X, Y direct

Board Flex

AEC-Q200-005

2mm(min), Dwell:30±1 sec.

High Temperature

Exposure (Storage)

MIL-STD-202 Method

108

85±2℃, 168+24hours

Inductance:within±10% of initial value

External Visual

Operational Life

MIL-PRF-27

85℃(Including self-heating), 168hrs, rated current

applied(as the part drawing).

Inductance:within±10% of initial value

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Additional Requirements

MIL-STD-202 Method

210

1. Max. 260±5℃,10±1s, 2 times

2.Solder Composition: Sn/3Ag/0.5Cu

10~55Hz,1.5mm,2 hours in each 3mutually perpendicular

directions,(total of 6 hours)

Inductance:within±10% of initial value

MIL-STD-202 Method

204

Temperature Cycling

-40℃~+85℃, 100cycles

Inductance:within±10% of initial value

JESD22 Method JA-104

Stress

Reference

Solderability

J-STD-002

Multilayer Ceramic Chip Inductors

Rev:A

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