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ADUC7023BCPZ62I-R7 Datasheet(PDF) 95 Page - Analog Devices

No. de pieza ADUC7023BCPZ62I-R7
Descripción Electrónicos  Precision Analog Microcontroller, 12-Bit Analog I/O, ARM7TDMI MCU with Enhanced IRQ Handler
PDF  98 Pages
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADUC7023BCPZ62I-R7 Datasheet(HTML) 95 Page - Analog Devices

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Data Sheet
ADuC7023
Rev. H | Page 95 of 98
OUTLINE DIMENSIONS
0.50
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.23
0.18
6.10
6.00 SQ
5.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.45
0.40
0.35
0.20 MIN
4.45
4.30 SQ
4.25
COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5
40
1
11
20
21
30
31
10
P IN 1
IN D IC ATO R AR E A OP T IO N S
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
EXPOSED
PAD
SEATING
PLANE
PIN 1
INDICATOR
AREA
Figure 55. 40-Lead Frame Chip Scale Package [LFCSP]
6 mm × 6 mm Body and 0.75 mm Package Height
(CP-40-10)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
1
0.50
BSC
3.50 REF
BOTTOM VIEW
TOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
3.65
3.50 SQ
3.45
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 56. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.75 mm Package Height
(CP-32-11)
Dimensions shown in millimeters



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