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HD151TS302ARP Datasheet(PDF) 8 Page - Renesas Technology Corp |
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HD151TS302ARP Datasheet(HTML) 8 Page - Renesas Technology Corp |
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8 / 12 page ![]() HD151TS302ARP Rev.5.00, May.19.2003, page 8 of 12 Application Information 1. Recommended Circuit Configuration The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2. VDD decoupling is important to both reduce Jitter and EMI radiation. The C1 decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the increased trace inductance will negate its decoupling capability. The C2 decoupling capacitor shown should be a tantalum type. 8 SEL1 1 7 CLKOUT 6 SEL0 5 SSCCLKOUT 2 VDD 3 GND GND GND 4 XIN XOUT C1 R1 R2 C2 TS300 Series (Crystal or Reference input) (Crystal or Not connection) Notes: C1 = High frequency supply decoupling capacitor. (0.1 µF recommended) C2 = Low frequency supply decoupling capacitor. (22 µF tantalum type recommended) R1, R2 = Match value to line impedance. (22 Ω Reference value) Figure 2 Recommended circuit configuration |
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