MIC79050

DS20005771B-page 18

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2017 - 2022 Microchip Technology Inc. and its subsidiaries.

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

Example

Example

XXXXX

X.XYNNNP

8-Lead SOIC*

3-Lead SOT-223*

Example

8-Lead MSOP* (front)

79050

4.2Y922P

XXXXX

-X.XY

79050

-4.2Y

XXXXX

-X.XXX

WNNN

79050

-4.2YM

9722

Example

8-Lead MSOP* (back)

WNNN

9722

Legend: XX...X Product code or customer-specific information

Y

Year code (last digit of calendar year)

YY

Year code (last 2 digits of calendar year)

WW

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

*

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle

mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information. Package may or may not include

the corporate logo.

Underbar (_) and/or Overbar (‾) symbol may not be to scale.

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